Knowledge Base
Inductors
|
Material / Substance |
Material Class |
Type |
Component Section(s) & Function / Role |
|
Manganese*-Zinc Ferrite (MnZn Ferrite) |
Ceramic |
★ Main |
[Active Part] Magnetic core |
|
Nickel*-Zinc Ferrite (NiZn Ferrite) |
Ceramic |
★ Main |
[Active Part] Magnetic core |
|
Iron (Fe) |
Steel |
★ Main |
[Active Part] Soft-magnetic composite/powder core [Termination] Termination compound |
|
Copper* (Cu) |
Heavy Metal |
★ Main |
[Active Part] Magnet wire forming the inductor winding [Termination] Base metal of terminals [Encapsulation] Encapsulation compound (Opt.) |
|
Wire enamel / insulation polymers (PUR, ETFE, Polyamide-imide, Polyester-imide, PA/PA66) |
Thermoplastic / Elastomer / Polymer |
★ Main |
[Active Part] Insulation coating on Cu winding wire and inter-layer bonding: • PUR (Polyurethane) — universal enamel on all transformer and choke families • ETFE — fluoropolymer enamel present is some drive transformers • THEIC/PAI (Polyester-imide / Polyamide-imide) — dual-layer high-temp enamel in some power-line ring-core chokes or signal chokes • PA (Polyamide) — winding insulation/wrapping |
|
Thermoplastic housings / bobbins (LCP, PC, PPS, PA/PA66/PA6, PBT, PET, Phenolic, DAP) |
Thermoplastic / Thermoset |
★ Main |
[Encapsulation] Thermoplastic housing: • LCP (Liquid Crystal Polymer) • PC (Polycarbonate) • PPS (Polyphenylene Sulfide) • PA / PA66 / PA6 • PBT (Polybutylene Terephthalate) • PET (Polyethylene Terephthalate • Phenolic / Phenolplast (PF) • DAP (Diallyl phthalate) |
|
Glass fiber (E-glass) — reinforcing filler |
Filler |
★ Main |
[Encapsulation] Reinforcing filler in all thermoplastic and thermoset housing/bobbin compounds (LCP, PC, PA, PBT, PPS, PF, DAP) |
|
Epoxy resin (EP) — encapsulant / potting / bobbin binder |
Duromer |
★ Main |
[Encapsulation] Encapsulation compound [Active Part] Active part compound in some variants |
|
Tin *(Sn) |
Heavy Metal |
★ Main |
[Termination] Sn outer plating on all terminations [Encapsulation] Encapsulation compound for some transofrmers and chokes |
|
Nickel* (Ni) |
Heavy Metal |
★ Main |
[Termination] Finish element |
|
Aluminium* oxide (Al₂O₃) — ceramic substrate |
Ceramic |
--- |
[Active Part] Non-magnetic ceramic core/substrate |
|
Core coatings / varnishes (Parylene, Alkyd resin, Acrylic resin— core bonding) |
Varnish / Duromer / Thermoplastic |
--- |
[Active Part] Surface coatings and bonding agents on magnetic cores: • Parylene (poly-para-xylylene) — conformal coating on NiZn ferrite core • Alkyd resin — protective varnish on iron I-core body • Acrylic resin — insulation coating on Cu winding |
|
Polyurethane (PUR) potting compound |
Duromer |
--- |
[Encapsulation] Encapsulation compound |
|
Insulating films / tapes (Polyimide PI, PET) |
Thermoplastic / Duromer / Woven |
--- |
[Encapsulation] Encapsulation compound • Polyimide (PI / Kapton-type) • PET film/tape |
|
Polydimethylsiloxane (PDMS) (Silicone foam) |
Elastomer |
--- |
[Encapsulation] Encapsulation compound |
|
Flame retardants (PFBS, Al(OH)₃, Triphenylphosphate, Red Phosphorous, Melamine Cyanurate) |
(additive) |
--- |
[Encapsulation] Flame-retardant additives and fillers used in housing/potting systems: • PFBS (perfluorobutane sulfonate) • Al(OH)₃ (Aluminium hydroxide) • Triphenylphosphate • Red Phosphorous • Melamine Cyanurate |
|
Inorganic additives / fillers (Zeolite, Silica/Quartz, Aluminium powder) |
(inorganic additive / filler) |
--- |
[Encapsulation] Mineral additives in polymer compounds: • Zeolite (aluminosilicate) • Silica / Quartz • Aluminium powder |
|
PTFE |
(filler) |
--- |
[Encapsulation] PTFE modifier in LCP housing compound |
|
Silver (Ag) |
Heavy / Noble Metal |
--- |
[Termination] Termination main compound with noble metal in some variant (Ag/Pd/Pt) |
|
Palladium * (Pd) |
Heavy / Noble Metal |
--- |
[Termination] Termination compound with noble metal in some variant (Ag/Pd/Pt) |
|
Platinum * (Pt) |
Heavy / Noble Metal |
--- |
[Termination] Termination compound with noble metal in some variant (Ag/Pd/Pt) |
|
Zinc (Zn) |
Heavy Metal |
--- |
[Termination] Compound in Cu-Ni-Zn termination |
|
Gold * (Au) |
Heavy / Noble Metal |
[Termination] Precious/refractory metal termination systems on some variant |
|
|
Tungsten ** (W) |
Heavy / Noble Metal |
[Termination] Precious/refractory metal termination systems on some variant |
|
|
Chromium (Cr) |
Metal |
Opt. |
[Active Part] Alloying elements in soft-magnetic composite Fe-Cr-Si powder core |
|
Silicon * (Si) |
Metal |
Opt. |
[Active Part] Alloying elements in soft-magnetic composite Fe-Cr-Si powder core |
|
FR4 board |
Composite |
Opt. |
[Encapsulation] Mechanical elements in encapsulation |
|
PVC |
Elastomer |
Opt. |
[Encapsulation] PVC sheathing on wire/lead insulation |
|
Bismuth * (Bi) |
Heavy Metal |
Opt. |
[Termination] Bi 3 wt% in Sn97/Bi3 lead-free solder finish |